Capabilities

Factory Overview

Modern smart factory with advanced manufacturing capabilities

5000㎡

Factory Area

10

SMT Lines

5M

Daily Capacity (Points)

300+

Skilled Employees

Core Equipment

Imported high-end equipment for precision manufacturing

Samsung Pick-and-Place Machine

Model: SM471+SM481
Speed: 78,000 CPH
Components: 01005~55mm
Accuracy: ±25μm@3σ

Reflow Oven

Model: Heller 1809MK5
Zones: 10
Nitrogen protection
Temp accuracy: ±1℃

Wave Soldering Machine

Model: JT-WS450
Dual wave soldering
For DIP components
Capacity: 4000pcs/H

AOI Optical Inspection

Brand: Omron
3D inspection technology
Speed: 40cm²/s
Defect detection rate: 99.9%

X-Ray Inspection

Brand: Dage
BGA/QFN solder joint inspection
Magnification: 20-200X
Resolution: 5μm

ICT/FCT Test Fixtures

In-circuit testing support
Custom functional test fixtures
Coverage rate: 95%+
Quick changeover

Technical Capabilities

Comprehensive process capabilities for diverse needs

Placement Capability
  • Min component: 01005 (0402 metric)
  • Max component: 55mm IC connector
  • BGA ball diameter: ≥0.2mm
  • QFP pitch: ≥0.3mm
Soldering Capability
  • Lead-free / leaded soldering
  • Nitrogen reflow soldering
  • Selective wave soldering
  • BGA/QFN rework
PCB Capability
  • PCB size: 50×50mm ~ 510×460mm
  • Board thickness: 0.4mm ~ 3.2mm
  • Layers: 1~20
  • Materials: FR-4 / Aluminum / Flex
Testing Capability
  • AOI optical inspection (3D)
  • X-Ray non-destructive testing
  • ICT in-circuit testing
  • FCT functional testing

Let Professionals Handle the Details

Contact us today for a free prototype evaluation

Contact Us